Solder-reflow is a very key part of SMT process and its role is to melt solder pastes, let SMT components and the PCB bonding plate firmly together; if it is not controlled better, it will have a devastating impact on the reliability of produced products and use life.

Manufacturer of device:
HEXI Electronic Equipment Co. Ltd

1.Independent hot-air circulation system

• Independent up-down heating module, independent hot air circulation, all PLC conducted by the district heating PID control, the furnace open linear separation system, fast, safe and reliable.

• And network with synchronous transport chain, from the computer to control the whole closed-loop design of high-intensity Guides, Guides and thermal deformation network with only a small amount track width modulated by speed motors, control panels, easy-to-use. Computer automatically controls lubrication system, according to the state machine and the speed automatic refueling and to adjust flow.

• Enforced internal recycling wind cooling system, with long cooling region, is good for the full cooling after PCB's welding. Simple structure and easy maintenance.

• Equipped with air-cooled Flux collection system, long-term protection of the furnace cleaning, more environmentally friendly emissions, high efficiency, recycling, recovering 85% of the furnace in flux, no filter design, extremely easy cleaning

• Nitrogen protection device nitrogen flow: 10∼30 m3/hour when oxygen concentration: 500∼800 ppm
• External water-cooling system power: 3 p refrigeration speed: ≥6°C/ sec
• Dual-track transport system independent adjustment range: 50 to 200 mm
• Central support system PCB minimum width: 70 mm

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